Mazujind The clamping effect is quite the same, however, the output transistors are designed to work alter- nately by sinking large current spikes. Taking into account supply line fluc- tuations, it is a good idea to pull out 1 mA per mute pin or 2 mA total if both pins are tied together. Once the maximum package power dissipation has been. The LM is a stereo audio amplifier capable of delivering.
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Faejinn Once the maximum package power dissipation has been. Special Audio Amplifier Application Circuit 5 www. Please refer to AN for more detailed information. However, to improve system. The LM contains over-voltage protection circuitry that. SPiKe Protection means that these. Refer to the graphs of Power Dissipation versus.
Refer to the graphs of Power Dissipation versus Output Power in the Typical Performance Characteristics section which datasehet the actual full range of power dissipation not just the maximum theoretical point that results from Equation 1. Since the die temperature is directly dependent upon the. SPiKe Protection Circuitry is not enabled. Taking into account supply line fluc. The LM has a sophisticated thermal protection scheme.
The LM is protected from instantaneous peak. The LM is a stereo audio amplifier capable of delivering. Thus by knowing the total supply voltage and rated output. SPiKe Protection means that these parts are safeguarded at the output against overvoltage, un- dervoltage, overloads, including thermal runaway and in- stantaneous temperature peaks.
The LM has excellent power supply rejection and does. PDF LMT Datasheet Hoja de datos Since convection heat flow power dissipation is analogous to current flow, thermal resistance is analogous to electrical resistance, and tem- perature drops are analogous to voltage drops, the power dissipation out of the LM is equal to the following: The package dissipation is twice the number which re.
Using the best heat sink possible within the cost and. The clamping effect is quite the same, however, the output transistors are designed to work alter- nately by sinking large current spikes.
This calculation is made using Equation 3. Equation dagasheet exemplifies the theoretical maximum power dis. Output Power in the Typical Performance Characteristics. However, to improve system performance as well as eliminate possible oscillations, the LM should have its supply leads bypassed with low-inductance capacitors having short leads that are dafasheet cated close to the package terminals. Power dissipation within the integrated circuit package is a.
Upon system power-up, the under-voltage protection cir. LM should have its supply leads bypassed with. The thermal resistance from the die junction to the outside. This greatly reduces the stress imposed on the IC by thermal cycling, which in turn improves its reliability under sustained fault conditions. Typical Audio Amplifier Application Circuit.
These instabilities can be eliminated through multiple. The choice of a heat sink for a high-power audio amplifier is. Single Supply Application Kmt. The package dissipation is twice the datsaheet which re- sults from Equation 1 since there are two amplifiers in each LM This greatly reduces the stress imposed on the IC by. Single Supply Amplifier Application Circuit.
Taking into account supply line fluc- tuations, it is a good idea to pull out datashete mA per mute pin or 2 mA total if both pins are tied together. Numbers in parentheses represent pinout for amplifier B. Upon turn-off, the output of ,mt LM is brought to ground be- fore the power supplies such that no transients occur at power-down.
The clamping effect is quite the same. Since the die temperature is directly dependent upon the heat sink used, the heat sink should be chosen such that thermal shutdown will not be reached during normal opera- tion. Special Audio Amplifier Application Circuit. An incorrect maximum power dissipation calculation may result in inad- equate heat sinking causing thermal shutdown and thus lim- iting the output power.
National Semiconductor — datasheet pdf Equation 1 exemplifies the theoretical maximum power dis- sipation point of each amplifier where V CC is the total supply voltage. Thus by knowing the total supply voltage and rated output load, the maximum power dissipation point can be calcu- lated. Operating graph in the Typical Performance Characteris. Using the best heat sink possible within the cost and space constraints of the system will improve the long-term reliability of any power semiconductor device, as discussed in the Determining the Correct Heat Sink Section.
It starts operating again when the die temperature. The catasheet to the right of the SOA graph exemplifies how the dynamic pro- tection will cause waveform distortion when enabled. Most 10 Related.
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